Title :
Molded chip scale package for high pin count
Author :
Baba, Shinji ; Tomita, Yoshihiro ; Matsuo, Mitsuyasu ; Matsushima, Hironori ; Ueda, Naoto ; Nakagawa, Osamu
Author_Institution :
Dept. of IC Assembly Eng., Mitsubishi Electr. Corp., Hyogo, Japan
fDate :
2/1/1998 12:00:00 AM
Abstract :
A unique molded chip scale package (CSP) associated 1024 pin counts has been developed. This package has the “bare die soldering” feature, that means highest mount density and enhanced electrical characteristic, and the “robust package” feature, that means easy to handle, to test and to standardize such as known good die (KGD). The wiring conductor patterns made of copper realized enhanced electrical characteristic. The solder bumping process with screen printing technique, was applied with cost competitiveness. And the transfer molding process produced high reliable package
Keywords :
integrated circuit packaging; soldering; CSP; Cu; bare die soldering; chip scale package; copper wiring conductor pattern; electrical characteristic; known good die; mount density; pin count; robust package; screen printing; solder bumping; transfer molding; Chip scale packaging; Cities and towns; Conductors; Costs; Electric variables; Electrodes; Large scale integration; Soldering; Testing; Wiring;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
