Title :
Efficient transient simulation of high-speed interconnects characterized by sampled data
Author :
Beyene, Wendemagegnehu T. ; Schutt-Ainé, Jose E.
Author_Institution :
Hewlett-Packard Co., Westlake Village, CA, USA
fDate :
2/1/1998 12:00:00 AM
Abstract :
In this paper, we present an algorithm for efficient simulation of high-speed interconnects characterized by sampled data. The method constructs pole-zero models of arbitrary interconnects using robust rational approximations of the measured or simulated scattering parameters. In order to obtain accurate interpolations of the data over a wide frequency range, a set of powerful techniques is applied to deal with the resulting ill-conditioned Vandermonde-like approximation matrices. By utilizing the analytic properties of the scattering parameters, the algorithm efficiently generates multiport pole-residue models. The models are combined with the lumped/distributed components for direct time- or frequency-domain simulations. The method can easily be implemented into conventional simulators such as simulation program with integrated circuit emphasis (SPICE) and advanced statistical analysis program (ASTAP) or reduced-order modeling techniques such as asymptotic waveform evaluation (AWE), complex frequency hopping (CFH), and Padd approximation via Lancros Process (PVL) for transient simulation of high-speed interconnect networks. Examples of linear and nonlinear networks are given to demonstrate the validity and accuracy of the method
Keywords :
S-parameters; circuit analysis computing; integrated circuit interconnections; interpolation; multiport networks; poles and zeros; reduced order systems; transient analysis; ASTAP; AWE; CFH; PVL; SPICE; Vandermonde matrix; algorithm; distributed component; frequency-domain simulation; high-speed interconnect; interpolation; linear network; lumped component; multiport pole-residue model; nonlinear network; pole-zero model; rational approximation; reduced-order model; sampled data; scattering parameters; time-domain simulation; transient simulation; Algorithm design and analysis; Analytical models; Circuit simulation; Frequency domain analysis; Integrated circuit interconnections; Interpolation; Robustness; SPICE; Scattering parameters; Statistical analysis;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on