• DocumentCode
    1334066
  • Title

    Computation of switching noise in printed circuit boards

  • Author

    Yook, Jong-Gwan ; Chandramouli, V. ; Katehi, Linda P B ; Sakallah, Karem A. ; Arabi, Tawfik R. ; Schreyer, Tim A.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
  • Volume
    20
  • Issue
    1
  • fYear
    1997
  • fDate
    3/1/1997 12:00:00 AM
  • Firstpage
    64
  • Lastpage
    75
  • Abstract
    Simultaneous switching noise (SSN) is a phenomenon with adverse and severe effects when a large number of high speed chip drivers switch simultaneously causing a large amount of current to be injected into the power distribution grid. The effects of SSN are manifested in a variety of transient and permanent system malfunctions including the appearance of undesirable glitches on what should otherwise be quiet signal lines and the flipping of state bits in registers and memories. Current approaches for dealing with SSN are largely ad hoc, relying primarily on the ability of expert designers to postulate worst-case scenarios for the occurrence of SSN-related errors and to analyze these scenarios using pessimistic estimates of packaging parasitics. This paper takes a first step toward evolving a systematic methodology for modeling and analysis of SSN in printed circuit boards (PCB´s). The presented methodology adopts a combination of macro- and micro-models which allow for a system level treatment of the problem without losing the necessary detailed descriptions of the power/ground planes, the signal traces and the vertical interconnections through vias or plated holes. This approach has been applied to a variety of PCB structures and has allowed for an effective characterization of switching noise and a comprehensive understanding of its effects on PCB performance
  • Keywords
    circuit noise; circuit switching; printed circuits; errors; glitch; ground plane; high speed chip driver; macro-model; memory; micro-model; packaging parasitics; plated hole; power distribution grid; printed circuit board; register; signal line; signal trace; simultaneous switching noise; state bit flipping; vertical interconnection; via; Circuit noise; Driver circuits; Error analysis; Packaging; Power distribution; Power system modeling; Printed circuits; Registers; Switches; Switching circuits;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.558546
  • Filename
    558546