Title :
An ultra-compact and low-power oven- controlled crystal oscillator design for precision timing applications
Author :
Lim, Jaehyun ; Kim, Hyunsoo ; Jackson, Thomas N. ; Choi, Kyusun ; Kenny, David
Author_Institution :
Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
fDate :
9/1/2010 12:00:00 AM
Abstract :
A novel design for a chip-scale miniature oven-controlled crystal oscillator (OCXO) is presented. In this design, all the main components of an OCXO-consisting of an oscillator, a temperature sensor, a heater, and temperature-control circuitry-are integrated on a single CMOS chip. The OCXO package size can be reduced significantly with this design, because the resonator does not require a separate package and most of the circuitry is integrated on a single CMOS chip. Other characteristics such as power consumption and warm-up time are also improved. Two different types of quartz resonators, an AT-cut tab mesa-type quartz crystal and a frame enclosed resonator, allow miniaturization of the OCXO structure. Neither of these quartz resonator types requires a separate package inside the oven structure; therefore, they can each be directly integrated with the custom-designed CMOS chip. The miniature OCXO achieves a frequency stability of ± 0.35 ppm with an AT-cut tab mesa-type quartz crystal in the temperature range of 0°C to 60°C. The maximum power consumption of this miniature OCXO is 1.2 W at start-up and 303 mW at steady state. The warm-up time to reach the steady state is 190 s. These results using the proposed design are better than or the same as high-frequency commercial OCXOs.
Keywords :
CMOS integrated circuits; crystal oscillators; integrated circuit design; integrated circuit packaging; low-power electronics; AT-cut tab mesa-type quartz crystal; chip-scale miniature oven-controlled crystal oscillator design; frame enclosed resonator; frequency stability; heater; package size; power 1.2 W; power 303 mW; power consumption; precision timing; quartz resonators; single CMOS chip integration; structure miniaturization; temperature 0 degC to 60 degC; temperature sensor; temperature-control circuitry; time 190 s; ultracompact low-power OCXO; warm-up time; Crystals; Heating; Oscillators; Resonant frequency; System-on-a-chip; Temperature measurement; Temperature sensors;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
DOI :
10.1109/TUFFC.2010.1638