Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: II. Theory

For pt.I see ibid., vol.19, no.4, pp.257-63 (1996). This paper presents new results from an experimental and theoretical program to evaluate relevant process parameters in the assembly of a 500 μm pitch area array component using anisotropic conductive adhesive (ACA) materials. This experimental configuration has features of micro ball grid array (μBGA) chip scale packaging (CSP) and also flip-chip and conventional ball grid array (BGA) package structures. The paper presents the results of computational fluid dynamics (CFD) models of the early stages of the assembly process when the adhesive is squeezed out between the device and the substrate. Experimental results on the assembly trials are presented in an accompanying paper and have been previously reported at the Adhesives in Electronics Conference, Gothenburg, 1996. The CFD models outlined here show how those results might be expected to change for smaller pitches