Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: II. Theory

Author

Mannan, Samjid H. ; Whalley, David C. ; Ogunjimi, Adebayo Oluyinka ; Williams, David J.

Author_Institution

Dept. of Manuf. Eng., Loughborough Univ. of Technol., UK

Volume

19

Issue

4

fYear

1996

fDate

10/1/1996 12:00:00 AM

Firstpage

264

Lastpage

269

Abstract

For pt.I see ibid., vol.19, no.4, pp.257-63 (1996). This paper presents new results from an experimental and theoretical program to evaluate relevant process parameters in the assembly of a 500 μm pitch area array component using anisotropic conductive adhesive (ACA) materials. This experimental configuration has features of micro ball grid array (μBGA) chip scale packaging (CSP) and also flip-chip and conventional ball grid array (BGA) package structures. The paper presents the results of computational fluid dynamics (CFD) models of the early stages of the assembly process when the adhesive is squeezed out between the device and the substrate. Experimental results on the assembly trials are presented in an accompanying paper and have been previously reported at the Adhesives in Electronics Conference, Gothenburg, 1996. The CFD models outlined here show how those results might be expected to change for smaller pitches

Keywords

adhesion; conducting materials; fine-pitch technology; flip-chip devices; fluid dynamics; microassembling; packaging; 500 micron; anisotropic conducting adhesive; assembly; ball grid array; chip scale packaging; computational fluid dynamics model; flip chip; micro ball grid array; planar array; Anisotropic magnetoresistance; Assembly; Chip scale packaging; Computational fluid dynamics; Conductive adhesives; Electronics packaging; Equations; Planar arrays; Resins; Substrates;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Publisher

ieee

ISSN

1083-4400

Type

jour

DOI

10.1109/3476.558553

Filename

558553