A hybrid amplifier as an RF building block

Author

Eskelinen, P. ; Salpala, A.

Author_Institution

Res. Labs., Kotka Inst. of Technol., Finland

Volume

11

Issue

8

fYear

1996

fDate

8/1/1996 12:00:00 AM

Firstpage

34

Lastpage

36

Abstract

A hybrid RF amplifier SMD-chip offers the benefit of a really simple bypass circuitry, ease of construction and minimal size. As an example, with the MiniCircuits VNA, a gain of about 15 dB can be achieved through the frequency band of 500 MHz to 3 GHz. Input matching can be near a VSWR of 1.9. At frequencies above 3 GHz however the input might provide a reflection coefficient greater than unity depending on the mechanical solutions of the test setup. Conventional assembly techniques can be used, but hybrid amplifiers are better-suited to more complex SMD boards

Keywords

hybrid integrated circuits; integrated circuit packaging; microwave amplifiers; radiofrequency amplifiers; surface mount technology; 15 dB; 500 MHz to 3 GHz; MiniCircuits VNA; RF amplifier SMD-chip; RF building block; SMD boards; VSWR; assembly; bypass circuitry; hybrid amplifier; hybrid amplifiers; input matching; Assembly; Capacitors; Connectors; Performance analysis; Prototypes; Radio frequency; Radiofrequency amplifiers; Reactive power; Reflection; System testing;

fLanguage

English

Journal_Title

Aerospace and Electronic Systems Magazine, IEEE

Publisher

ieee

ISSN

0885-8985

Type

jour

DOI

10.1109/62.533754

Filename

533754