DocumentCode :
1334974
Title :
In-Plane Gate Transistors Fabricated by Using Atomic Force Microscopy Anode Oxidation
Author :
Chung, Tung-Hsun ; Chen, Shu-Han ; Liao, Wen-Hsuan ; Lin, Shih-Yen
Author_Institution :
Res. Center for Appl. Sci., Acad. Sinica, Taipei, Taiwan
Volume :
31
Issue :
11
fYear :
2010
Firstpage :
1227
Lastpage :
1229
Abstract :
An in-plane gate transistor fabricated by using the atomic force microscopy (AFM) lithography is investigated in this letter. By performing repeated oxidation and deoxidation procedures by using the AFM for four times, two V-shaped trenches are fabricated on the prepatterned mesas to isolate the electrical terminals of the device. Without exposing the channel region to the atmosphere, the device has exhibited standard transistor current-voltage characteristics in the 0-5 V range at room temperature, which may be advantageous for the future high-speed application of the device.
Keywords :
atomic force microscopy; insulated gate field effect transistors; isolation technology; lithography; atomic force microscopy anode oxidation; atomic force microscopy lithography; channel region; deoxidation procedure; electrical terminal; in plane gate transistor; prepatterned mesa; temperature 293 K to 298 K; voltage 0 V to 5 V; Gallium arsenide; Lithography; Logic gates; Microscopy; Oxidation; Resistance; Transistors; Atomic force microscopy (AFM); in-plane gate transistors;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2010.2068273
Filename :
5585701
Link To Document :
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