• DocumentCode
    133500
  • Title

    Real-time monitoring and diagnosis of a train door mechatronic system

  • Author

    Cauffriez, Laurent ; Grondel, Sebastien

  • Author_Institution
    TEMPO-PSI EA4542, Univ. Valenciennes, Valenciennes, France
  • fYear
    2014
  • fDate
    10-12 Sept. 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    For train manufacturers, a technical, economical, and societal key issue is the real-time monitoring and diagnosis of a train door in new generation of urban trains. Therefore, this paper proposes to deal with the modeling and diagnosis of a train door mechatronic system. For this purpose, the system is first detailed and shows a coupling between electrical and mechanical domains. As the modelling of such a mechatronic system needs a multidisciplinary and unified tool, the bond graph representation is chosen. Moreover, this model contains key components needed to reproduce the door movements and frictions. Thanks to this bond graph model, a global model-based FDI (Fault Detection and Isolation) is proposed for residual computations. Finally, the characterization of residuals for certain internal failures is investigated and the ability of the proposed diagnostic model to detect these failures and isolate some of them is demonstrated. The methodology employed is intended to be applied in a near future in real-time on the practical system.
  • Keywords
    bond graphs; condition monitoring; doors; failure analysis; fault location; friction; locomotives; mechatronics; FDI; bond graph representation; door movements; fault detection-isolation; fault diagnosis; friction; internal failures; real-time monitoring; train door mechatronic system; Computational modeling; Equations; Fault detection; Friction; Load modeling; Mathematical model; Mechatronics; Bond Graph; Fault detection and isolation; Mechatronic system; Residuals; Train door;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronic and Embedded Systems and Applications (MESA), 2014 IEEE/ASME 10th International Conference on
  • Conference_Location
    Senigallia
  • Print_ISBN
    978-1-4799-2772-2
  • Type

    conf

  • DOI
    10.1109/MESA.2014.6935525
  • Filename
    6935525