Title :
Microwave Circuits in Paper Substrates Exploiting Conductive Adhesive Tapes
Author :
Alimenti, F. ; Mezzanotte, P. ; Dionigi, Marco ; Virili, M. ; Roselli, Luca
Author_Institution :
Dept. of Electronic and Information Engineering, University of Perugia, Perugia, Italy
Abstract :
In this work, a new technique to fabricate microwave circuits in paper substrates is proposed. This technique relies on a copper adhesive tape that is shaped by a photo-lithographic process and then transferred to the hosting substrate by means of a sacrificial layer. Microstrip lines in paper substrates have been electromagnetically characterized accounting also for the adhesive layers. Experimental results show an insertion loss better than 0.6 dB/cm at 10 GHz.
Keywords :
Fabrication; Microstrip; Microwave circuits; Substrates; Transmission lines; Flexible substrates; green electronics; microwave circuits; paper substrates; transmission lines;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2012.2227141
