• DocumentCode
    1335773
  • Title

    AlInN/AlN/GaN HEMT Technology on SiC With 10-W/mm and 50% PAE at 10 GHz

  • Author

    Sarazin, N. ; Morvan, E. ; di Forte Poisson, M.A. ; Oualli, M. ; Gaquiére, C. ; Jardel, O. ; Drisse, O. ; Tordjman, M. ; Magis, M. ; Delage, S.L.

  • Author_Institution
    III-V Lab., Alcatel-Thales, Marcoussis, France
  • Volume
    31
  • Issue
    1
  • fYear
    2010
  • Firstpage
    11
  • Lastpage
    13
  • Abstract
    High-frequency high-electron-mobility transistors (HEMTs) were fabricated on AlInN/AlN/GaN heterostructures grown by low-pressure metal-organic chemical vapor deposition on a SiC substrate. The results presented in this letter confirm the high performance that is reachable by AlInN-based technology with an output power of 10.3 W/mm and a power-added efficiency of 51% at 10 GHz with a gate length of 0.25 ??m. A good extrinsic transconductance value that is greater than 450 mS/mm and exceeding AlGaN/GaN HEMT results was also measured on these transistors. To our knowledge, these results are the best power results published on AlInN/GaN HEMTs. These good results were attributed to optimized heterostructure properties associated with low-resistance ohmic contacts and an effective passivation layer minimizing drain current slump in high-frequency operations.
  • Keywords
    MOCVD; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; silicon compounds; AlInN-AlN-GaN; HEMT technology; SiC; efficiency 50 percent; efficiency 51 percent; frequency 10 GHz; high-frequency high-electron-mobility transistors; low-pressure metal-organic chemical vapor deposition; low-resistance ohmic contacts; size 0.25 mum; AlInN; GaN; high-electron-mobility transistor (HEMT); metal–organic chemical vapor deposition;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2009.2035145
  • Filename
    5337923