Title :
AlInN/AlN/GaN HEMT Technology on SiC With 10-W/mm and 50% PAE at 10 GHz
Author :
Sarazin, N. ; Morvan, E. ; di Forte Poisson, M.A. ; Oualli, M. ; Gaquiére, C. ; Jardel, O. ; Drisse, O. ; Tordjman, M. ; Magis, M. ; Delage, S.L.
Author_Institution :
III-V Lab., Alcatel-Thales, Marcoussis, France
Abstract :
High-frequency high-electron-mobility transistors (HEMTs) were fabricated on AlInN/AlN/GaN heterostructures grown by low-pressure metal-organic chemical vapor deposition on a SiC substrate. The results presented in this letter confirm the high performance that is reachable by AlInN-based technology with an output power of 10.3 W/mm and a power-added efficiency of 51% at 10 GHz with a gate length of 0.25 ??m. A good extrinsic transconductance value that is greater than 450 mS/mm and exceeding AlGaN/GaN HEMT results was also measured on these transistors. To our knowledge, these results are the best power results published on AlInN/GaN HEMTs. These good results were attributed to optimized heterostructure properties associated with low-resistance ohmic contacts and an effective passivation layer minimizing drain current slump in high-frequency operations.
Keywords :
MOCVD; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; silicon compounds; AlInN-AlN-GaN; HEMT technology; SiC; efficiency 50 percent; efficiency 51 percent; frequency 10 GHz; high-frequency high-electron-mobility transistors; low-pressure metal-organic chemical vapor deposition; low-resistance ohmic contacts; size 0.25 mum; AlInN; GaN; high-electron-mobility transistor (HEMT); metal–organic chemical vapor deposition;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2009.2035145