DocumentCode :
1336008
Title :
4H-silicon carbide modified-anode gate turn-off thyristor
Author :
Shah, P.B.
Author_Institution :
US Army Res. Lab., AMSRL-SE-RL, Adelphi, MD, USA
Volume :
36
Issue :
7
fYear :
2000
fDate :
3/30/2000 12:00:00 AM
Firstpage :
671
Lastpage :
672
Abstract :
4H-silicon carbide modified-anode gate turn-off thyristor drift-diffusion model simulations of a pn-pn-pn type silicon carbide modified-anode gate turn-off (MA-GTO) thyristor structure indicate that the addition of thin n-p layers below the p-type anode region assists hole injection into the drift region of the thyristor. This allows current crowding to be avoided by increasing the dopant concentration of the n-type gated base layer without the consequence of a drastic increase in on-state voltage drop and holding current
Keywords :
doping profiles; semiconductor device models; silicon compounds; thyristors; wide band gap semiconductors; 4H-SiC device; MA-GTO thyristor structure; SiC; current crowding elimination; dopant concentration; drift region; drift-diffusion model simulations; gate turn-off thyristor; holding current; hole injection; modified-anode GTO thyristor; n-type gated base layer; on-state voltage drop; p-type anode region; pn-pn-pn type; thin n-p layers;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20000525
Filename :
842232
Link To Document :
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