DocumentCode :
1336234
Title :
Comments on "Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
Author :
Yin, Huiming M.
Author_Institution :
Dept. of Civil Eng. & Eng. Mech., Columbia Univ., New York, NY, USA
Volume :
33
Issue :
2
fYear :
2010
fDate :
5/1/2010 12:00:00 AM
Firstpage :
353
Lastpage :
355
Abstract :
An approach previously developed by Suhir in 1986 for calculating the interfacial compliance of a long-narrow strip is a general, explicit method, but Basaran and Wen claimed that there had been an error in the derivation. Using an additional approximation, they obtained a different form of longitudinal interfacial compliance. However, that approximation is not appropriate. Disregarding it, we can see that their result is the same as Suhir´s result. However, a minor inconsistence in Suhir´s derivation is still found. The applicability and modification of Suhir´s model are discussed.
Keywords :
approximation theory; electronics packaging; integrated circuits; Basaran; Suhir; Wen; approximation; interfacial compliance influence; longitudinal interfacial compliance; multilayered microelectronic packaging; thermomechanical stresses; Capacitive sensors; Civil engineering; Electronics packaging; Equations; Microelectronics; Strips; Thermal stresses; Thermomechanical processes; Transistors; Elastic analysis; electronic packaging; interfacial compliance; thin film;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2009.2033571
Filename :
5337990
Link To Document :
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