Title :
150-GHz RF SOI-CMOS Technology in Ultrathin Regime on Organic Substrate
Author :
Etangs-Levallois, Aurélien Lecavelier des ; Dubois, Emmanuel ; Lesecq, Marie ; Danneville, François ; Poulain, Laurent ; Tagro, Yoann ; Lepilliet, Sylvie ; Gloria, Daniel ; Raynaud, Christine ; Troadec, David
Author_Institution :
Inst. d´´Electron. et de Microelectron. et de Nanotechnol., Villeneuve-d´´Ascq, France
Abstract :
This letter provides an experimental demonstration of high-performance industrial MOSFETs thinned down to 5.7 μm and transferred onto a 125-μm-thick polyethylene naphthalate foil. The die stack transferred onto the organic substrate comprises the 200-nm-thick active layer and the 5.5-μm-thick interconnection multilayer stack resulting in a light, compact, and bendable thin film. We unveil that dc and RF performances are invariant even for ultimate thinning down to the buried oxide layer. Furthermore, n-MOSFET performance is improved by 1.5× compared with previous work, and the first demonstration of 100-GHz p-MOSFETs on an organic substrate is presented. Unity-current-gain cutoff and maximum oscillation frequencies as high as 150/160 GHz for n-MOSFETs and 100/130 GHz for p-MOSFETs on a plastic substrate have been measured, respectively.
Keywords :
CMOS integrated circuits; MOSFET; integrated circuit interconnections; millimetre wave integrated circuits; silicon-on-insulator; thin films; RF SOI-CMOS technology; active layer; buried oxide layer; die stack; frequency 100 GHz; frequency 130 GHz; frequency 150 GHz; frequency 160 GHz; high-performance industrial MOSFET; interconnection multilayer stack; n-MOSFET; organic substrate; p-MOSFET; plastic substrate; polyethylene naphthalate foil; size 125 mum; size 200 nm; size 5.5 mum; size 5.7 mum; thin film; ultrathin regime; Cutoff frequency; MOSFET circuits; Plastics; Radio frequency; Silicon; Substrates; Transistors; CMOS; organic substrate; plastic; thin film;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2011.2166241