Title :
Two-dimensional numerical simulation of radical generation in the positive corona discharge
Author :
Kim, Youn Taeg ; Whang, Ki Woong
Author_Institution :
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
fDate :
2/1/2000 12:00:00 AM
Abstract :
By a two-dimensional (2-D) numerical simulation of positive corona with extensive chemical reactions, two parameters such as E/Neff (effective electric field for electrical energy transfer) and G-factor are calculated. E/Neff weakly depends on the humidity but strongly depends on the applied voltage. As the applied voltage increases, the corona formation and propagation time decrease, but the other parameters show very weak dependence. Electron collision G-factors of OH, O radicals reach their maximum value at E/Neff N~150 Td but electron collision G-factor of N radical increase with E/N. Full chemical reaction considered G-factor shows different time evolution characteristics with E/Neff. Since the dominant reaction process for the N, O radical is through the electron collision, the electron collision G-factor and E/Neff well represent the full chemical reaction considered G-factor. But the OH radical is dominantly generated by the radical reactions. The G-factor of OH radical shows a time-delayed characteristic
Keywords :
air pollution; corona; free radicals; humidity; plasma chemistry; plasma collision processes; plasma simulation; 2-D numerical simulation; O; O radicals; OH; OH radicals; acid rain; air pollution; applied voltage; chemical reactions; corona formation; effective electric field; electrical energy transfer; electron collision; electron collision G-factors; humidity; positive corona discharge; propagation time; pulse corona induced plasma chemical process; radical generation; time evolution characteristics; time-delayed characteristic; two-dimensional numerical simulation; Character generation; Chemical processes; Corona; Electrons; Energy exchange; Equations; Fault location; Numerical simulation; Two dimensional displays; Voltage;
Journal_Title :
Plasma Science, IEEE Transactions on