• DocumentCode
    1337644
  • Title

    Design trade-offs for the last stage of an unregulated, long-channel CMOS off-chip driver with simultaneous switching noise and switching time considerations

  • Author

    Yang, Yaochao ; Brews, John R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
  • Volume
    19
  • Issue
    3
  • fYear
    1996
  • fDate
    8/1/1996 12:00:00 AM
  • Firstpage
    481
  • Lastpage
    486
  • Abstract
    Design trade-off relations for the last stage of a complementary metal-oxide-semiconductor (CMOS) off-chip driver that meets a prespecified normalized maximum simultaneous switching ground noise and a prespecified normalized time when the switched N-channel metal-oxide-semiconductor transistor (NMOST) leaves the saturation region are provided in this paper. To maintain system performance with control of 90-10% fall time and/or 10-90% rise time, the proposed trade-off relations are then modified numerically for design with prespecified fall/rise time. The proposed trade-offs relate the normalized simultaneous switching noise and the normalized switching time to driver size, load capacitance, ground/power path inductance, number of switching drivers, and input signal rise time. It will be shown that a dimensionless analysis method allows design to be extended to a variety of systems that share the same dimensionless performance. Such a feature will be demonstrated by SPICE simulations of circuits based upon the proposed design relations and MOS1 model, which agrees well with the design goals
  • Keywords
    CMOS integrated circuits; SPICE; driver circuits; integrated circuit design; integrated circuit noise; MOS1 model; NMOS transistor; SPICE simulation; design; dimensionless analysis; fall time; last stage; rise time; simultaneous switching noise; switching time; unregulated long-channel CMOS off-chip driver; Capacitance; Components, packaging, and manufacturing technology; Control systems; Driver circuits; Electronics packaging; Inductance; Noise generators; Noise reduction; Semiconductor device noise; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.533886
  • Filename
    533886