DocumentCode :
1337644
Title :
Design trade-offs for the last stage of an unregulated, long-channel CMOS off-chip driver with simultaneous switching noise and switching time considerations
Author :
Yang, Yaochao ; Brews, John R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume :
19
Issue :
3
fYear :
1996
fDate :
8/1/1996 12:00:00 AM
Firstpage :
481
Lastpage :
486
Abstract :
Design trade-off relations for the last stage of a complementary metal-oxide-semiconductor (CMOS) off-chip driver that meets a prespecified normalized maximum simultaneous switching ground noise and a prespecified normalized time when the switched N-channel metal-oxide-semiconductor transistor (NMOST) leaves the saturation region are provided in this paper. To maintain system performance with control of 90-10% fall time and/or 10-90% rise time, the proposed trade-off relations are then modified numerically for design with prespecified fall/rise time. The proposed trade-offs relate the normalized simultaneous switching noise and the normalized switching time to driver size, load capacitance, ground/power path inductance, number of switching drivers, and input signal rise time. It will be shown that a dimensionless analysis method allows design to be extended to a variety of systems that share the same dimensionless performance. Such a feature will be demonstrated by SPICE simulations of circuits based upon the proposed design relations and MOS1 model, which agrees well with the design goals
Keywords :
CMOS integrated circuits; SPICE; driver circuits; integrated circuit design; integrated circuit noise; MOS1 model; NMOS transistor; SPICE simulation; design; dimensionless analysis; fall time; last stage; rise time; simultaneous switching noise; switching time; unregulated long-channel CMOS off-chip driver; Capacitance; Components, packaging, and manufacturing technology; Control systems; Driver circuits; Electronics packaging; Inductance; Noise generators; Noise reduction; Semiconductor device noise; Voltage;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.533886
Filename :
533886
Link To Document :
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