Title :
Thermal management of VCSEL-based optoelectronic modules
Author :
Lee, Yung-Cheng ; SWIRHUN, Stanley E. ; Fu, Winston S. ; Keyser, Tim A. ; Jewell, Jack L. ; Quinn, William E.
Author_Institution :
Center for Optoelectron. Comput. Syst., Colorado Univ., Boulder, CO, USA
fDate :
8/1/1996 12:00:00 AM
Abstract :
Thermal management is critical to reliable optoelectronic modules based on vertical-cavity surface-emitting lasers (VCSELs). One critical thermal path to be managed is from a VCSEL to a case (heat sink), which is affected by packaging technologies and materials The measured VCSEL-to-case resistance of a laser with 8-μm aperture was 1650°C/W, and that of a 20-μm device was 1070°C/W. These thermal resistances are much larger than those for the edge-emitting lasers; advanced device and packaging technologies are being developed to reduce these resistances. To study the packaging effects, a three-dimensional (3-D) numerical model has been developed and calibrated by the measured data. The calibrated model was used to understand the difference in thermal behavior: 1) between a wire-bonded and a flip-chip VCSEL module, 2) between a single-VCSEL and an 8×8 VCSEL module, and 3) between a bottom-cooled and a top-cooled module
Keywords :
cooling; flip-chip devices; heat sinks; lead bonding; packaging; surface emitting lasers; thermal resistance; 20 micron; 3D numerical model; 8 micron; VCSEL-based optoelectronic modules; VCSEL-to-case resistance; bottom-cooled module; critical thermal path; flip-chip module; heat sink; packaging technologies; thermal management; thermal resistances; top-cooled module; vertical-cavity surface-emitting lasers; wire-bonded module; Electrical resistance measurement; Heat sinks; Packaging; Resistance heating; Surface emitting lasers; Surface resistance; Technology management; Thermal management; Thermal resistance; Vertical cavity surface emitting lasers;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
