Low temperature bonding of epitaxial lift off devices with AuSn

Author

Dohle, G. Rainer ; Drabik, Timothy J. ; Callahan, John J. ; Martin, Kevin P.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

19

Issue

3

fYear

1996

fDate

8/1/1996 12:00:00 AM

Firstpage

575

Lastpage

580

Abstract

The increasing demand for more advanced optoelectronic integrated circuits has created the need for bonding materials with different lattice constants (for example, GaAs on Si). In this paper, we report a new way for the bonding of epitaxial lift off (ELO) devices onto substrates. The multilayer structures investigated in this work produce a resulting AuSn alloy with approximately 84 wt.% gold, but can be bonded with a peak temperature of 235°C. The bonded samples were investigated with several standard surface analysis techniques like optical microscopy, scanning electron microscopy (SEM), and energy dispersive X-ray analysis (EDX) as well as mechanical tests. The results of our research allowed us to optimize the layer structure, the bonding parameters as well as the diffusion barriers

Keywords

X-ray chemical analysis; diffusion barriers; gold alloys; integrated optoelectronics; lattice constants; optical microscopy; scanning electron microscopy; tin alloys; wafer bonding; 235 degC; AuSn; ELO devices; bonding materials; bonding parameters; diffusion barriers; energy dispersive X-ray analysis; epitaxial lift off devices; lattice constants; low temperature bonding; mechanical tests; multilayer structures; optical microscopy; optoelectronic integrated circuits; peak temperature; scanning electron microscopy; surface analysis techniques; Bonding; Electron optics; Gallium arsenide; Gold alloys; Lattices; Nonhomogeneous media; Optical microscopy; Scanning electron microscopy; Substrates; Temperature;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.533898

Filename

533898