Title :
High-Performance AlN/GaN HEMTs on Sapphire Substrate With an Oxidized Gate Insulator
Author :
Chabak, Kelson D. ; Walker, D.E. ; Johnson, Michael R. ; Crespo, Antonio ; Dabiran, Amir M. ; Smith, David.J. ; Wowchak, Andrew M. ; Tetlak, Stephen K. ; Kossler, Mauricio ; Gillespie, James K. ; Fitch, Robert C. ; Trejo, Manuel
Author_Institution :
Air Force Res. Lab., Wright-Patterson Air Force Base, Dayton, OH, USA
Abstract :
This letter presents transistor device results on ultrathin AIN/GaN high-electron mobility transistors grown on a sapphire substrate with high dc/RF performance, including low gate leakage and high transconductance. Devices with 80and 180-nm T-gates are compared, which demonstrate drain-induced OFF-state gate leakage currents below 10-6 A/mm and extrinsic transconductance gm ~ 500 mS/mm by utilizing a ~2-3 nm amorphous oxide layer formed under the T-gate during processing. In addition, excellent dc results such as RC <; 0.50 Ω · mm and pulsed IDS,max ~1.75 A/mm are reported. Small-signal RF performance using an 80-nm T-gate achieved ft >; 100 GHz operation, which is among the best so far reported for AIN/GaN technology.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; sapphire; wide band gap semiconductors; AlN-GaN; HEMT; T-gate; amorphous oxide layer; drain-induced OFF-state gate leakage current; extrinsic transconductance; oxidized gate insulator; sapphire substrate; size 180 nm; size 80 nm; transistor device; ultrathin high-electron mobility transistors; Gallium nitride; HEMTs; Leakage current; Logic gates; MODFETs; Substrates; Transconductance; Aluminum nitride; high-electron-mobility transistor (HEMT); lattice strain; low gate leakage; sapphire substrate;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2011.2167952