• DocumentCode
    1337868
  • Title

    Fiber-Coupled Light-Emitting Diode With a Capillary-Bonded Hemispherical Lens

  • Author

    Zhu, L. ; Huang, S.Y. ; Lai, P.T. ; Choi, H.W.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
  • Volume
    23
  • Issue
    24
  • fYear
    2011
  • Firstpage
    1857
  • Lastpage
    1859
  • Abstract
    A hemispherical lens capillary-bonded to an InGaN flip-chip light-emitting diode (LED) is demonstrated to efficiently couple light to a plastic optical fiber. The BK-7 hemispherical lens is bonded onto a circularly shaped LED chip with inclined sidewalls cut by laser-micromachining, so that lateral emissions are effectively suppressed. Capillary bonding minimizes air-gap between chip and lens enabling transmission of evanescent waves, thus maximizing overall optical transmission. With the lens attached, emission divergence from the assembly is significantly reduced, diverting rays into the acceptance cone of the fiber. Fiber coupling efficiency as high as 53.8% has been demonstrated.
  • Keywords
    III-V semiconductors; bonding processes; capillarity; flip-chip devices; gallium compounds; indium compounds; laser beam machining; lenses; light emitting diodes; micromachining; optical fibres; wide band gap semiconductors; InGaN; capillary-bonded hemispherical lens; circularly shaped LED chip; evanescent wave transmission; fiber-coupled light-emitting diode; flip-chip light-emitting diode; laser-micromachining; optical transmission; plastic optical fiber; Light emitting diodes; Optical fiber communication; Optical fiber devices; Optical surface waves; Fiber coupling; light-emitting diode (LED);
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2011.2170407
  • Filename
    6032712