• DocumentCode
    1337874
  • Title

    A high-temperature electronic system for pressure-transducers

  • Author

    de Jong, Paul C. ; Meijer, Gerard C M

  • Author_Institution
    Fac. of Electr. Eng., Delft Univ. of Technol., Netherlands
  • Volume
    49
  • Issue
    2
  • fYear
    2000
  • fDate
    4/1/2000 12:00:00 AM
  • Firstpage
    365
  • Lastpage
    370
  • Abstract
    This paper describes a high-temperature pressure-transducer interface for resistive Wheatstone bridges. The long-term drift of the smart sensor, i.e., the (pressure) sensor plus its interface electronics, will be determined by the drift of the sensor element only. A three-signal auto-calibration sequence of the interface electronics keeps the transducer interface virtually free of long-term drift. A novel low-drift preamplifier forms an essential element in this system. The high-temperature operation of the transducer interface has been investigated from both an electronic and a packaging point of view. The system has been realized by combining CMOS ASICs with a thick-film packaging technology. The pressure-transducer interface works up to 250-275°C with 15-16 bits accuracy
  • Keywords
    CMOS integrated circuits; application specific integrated circuits; bridge circuits; calibration; feedback amplifiers; high-temperature electronics; instrumentation amplifiers; integrated circuit packaging; intelligent sensors; lead bonding; preamplifiers; pressure transducers; thermal management (packaging); 250 to 275 C; CMOS ASIC; die bonding; dynamic element matching; dynamic feedback instrumentation amplifier; electromigration problems; high-temperature electronic system; high-temperature pressure-transducer interface; hybrid packaging; interface electronics; leakage currents; long-term drift; low-drift preamplifier; resistive Wheatstone bridges; smart sensor; temperature-resistant package; thick-film packaging technology; three-signal auto-calibration sequence; wire bonding; Bridge circuits; CMOS technology; Circuit stability; Electronics packaging; Intelligent sensors; Pressure gauges; Space technology; Temperature sensors; Transducers; Voltage;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/19.843079
  • Filename
    843079