DocumentCode
1337910
Title
Interconnect propagation delay modeling and validation for the 16-MB CMOS SRAM chip
Author
Apati, Venkatapathi N Ray ; Kaminska, Bozena
Author_Institution
Ecole Polytech., Montreal Univ., Que., Canada
Volume
19
Issue
3
fYear
1996
fDate
8/1/1996 12:00:00 AM
Firstpage
605
Lastpage
614
Abstract
In this paper, a closed-form expression for complementary metal-oxide semiconductor (CMOS) static random access memory component (SRAM) chip propagation delay is developed. This allows accurate calculation of the signal propagation delay of multilayer interconnects within the CMOS SRAM chip and also takes into account the delay of the CMOS SRAM cells driving the branched transmission line and the driving SRAM cell loading aspects of the interconnect line. Simulation results are presented to show the accuracy and efficiency of the propagation delay model. A case study of 16 MB CMOS SRAM chip performance evaluation is presented. The proposed closed-form delay expression results in an absolute maximum error smaller than 4.8% in comparison to the measured data. The proposed closed-form expression can be used for various high-speed, high-density multilayer interconnect SRAMs, dynamic random access memories (DRAMs), FPGAs, and application-specific integrated circuits (ASIC´s)
Keywords
CMOS memory circuits; SRAM chips; delays; integrated circuit interconnections; integrated circuit modelling; 16 MB; CMOS SRAM chip; branched transmission line; high-speed high-density IC; multilayer interconnect; signal propagation delay model; simulation; Closed-form solution; Integrated circuit interconnections; MOS devices; Nonhomogeneous media; Propagation delay; Random access memory; SRAM chips; Semiconductor device measurement; Semiconductor device modeling; Transmission lines;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.533903
Filename
533903
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