Title :
Measurement of IC package shielding effectiveness using an integrated antenna
Author :
Roy, Langis ; Rollin, Jacques J. ; Arcari, Gianluca
Author_Institution :
Sch. of Inf. Technol. & Eng., Ottawa Univ., Ont., Canada
fDate :
4/1/2000 12:00:00 AM
Abstract :
A novel technique for measuring integrated circuit (IC) package shielding effectiveness is presented. The technique is based on radiated field measurements performed with an integrated circuit antenna in a Gigahertz transverse electromagnetic (GTEM) cell. A thorough test procedure which takes into account all possible field contributions is proposed. The technique is simple to implement, cost effective, and suitable for characterizing IC package shielding effectiveness up to 10 GHz
Keywords :
antenna radiation patterns; ball grid arrays; electromagnetic compatibility; electromagnetic shielding; integrated circuit measurement; integrated circuit packaging; integrated circuit testing; microstrip antennas; 10 GHz; Gigahertz transverse electromagnetic cell; IC package; cost effective technique; electromagnetic compatibility; enclosed antenna die; field contributions; integrated antenna; plastic BGA; printed strips; radiated field measurements; shielding effectiveness measurement; super BGA; Antenna measurements; Circuit testing; Costs; Electromagnetic fields; Electromagnetic measurements; Electromagnetic radiation; Electromagnetic shielding; Integrated circuit measurements; Integrated circuit packaging; Performance evaluation;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
