Title :
A 64-Mb Chain FeRAM With Quad BL Architecture and 200 MB/s Burst Mode
Author :
Hoya, Katsuhiko ; Takashima, Daisaburo ; Shiratake, Shinichiro ; Ogiwara, Ryu ; Miyakawa, Tadashi ; Shiga, Hidehiro ; Doumae, Sumiko M. ; Ohtsuki, Sumito ; Kumura, Yoshinori ; Shuto, Susumu ; Ozaki, Tohru ; Yamakawa, Koji ; Kunishima, Iwao ; Nitayama, Aki
Author_Institution :
Center for Semicond. R&D, Toshiba Corp., Yokohama, Japan
Abstract :
A 64-Mb chain ferroelectric RAM (chainFeRAM) is fabricated using 130-nm 3-metal CMOS technology. A newly developed quad bitline architecture, which combines folded bitline configuration with shield bitline scheme, eliminates bitline-bitline (BL-BL) coupling noise. The quad bitline architecture also reduces the number of sense amplifiers and activated bitlines, resulting in the reduction of die size by 6.5% and cell array power consumption by 28%. Fast read/write of 60-ns cycle time as well as reliability improvement are realized by two high-speed error checking and correcting (ECC) techniques: 1) fast pre-parity calculation ECC sequence and 2) all-“0”-write-before-data-write scheme. Moreover, among nonvolatile memories reported so far, the 64 Mb chain FeRAM has achieved the highest read/write bandwidth of 200 MB/s with ECC. The chip size is 87.5 mm2 with average cell size of 0.7191 μm2.
Keywords :
CMOS memory circuits; ferroelectric storage; integrated circuit reliability; random-access storage; CMOS technology; ECC technique; bitline-bitline coupling noise; burst mode; cell array power consumption; chain FeRAM; chain ferroelectric RAM; die size; folded bitline configuration; high-speed error checking and correcting technique; quad BL architecture; quad bitline architecture; reliability improvement; sense amplifier; shield bitline scheme; size 130 nm; Bandwidth; CMOS technology; Energy consumption; Error correction; Error correction codes; Ferroelectric films; Nonvolatile memory; Power amplifiers; Random access memory; Semiconductor device noise; Burst mode; ferroelectric memory; nonvolatile memory;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2009.2034380