Title :
On-chip interconnect lines with patterned ground shields
Author :
Lowther, Rex ; Lee, Sang-Gug
Author_Institution :
Harris Semicond., Melbourne, FL, USA
fDate :
2/1/2000 12:00:00 AM
Abstract :
Measurements of on-chip interconnect lines with a patterned ground shield (PGS) are analyzed and compared to lines with no ground shield (NGS). At frequencies at and below 7 GHz, the PGS lines have about one fifth the dissipative loss of that of the NGS lines. By using a doped layer in the silicon for the shield, as opposed to other metal layers which are closer to the line, a reasonably high characteristic impedance is maintained. The transmission line characteristics are also analyzed
Keywords :
MMIC; UHF integrated circuits; coplanar transmission lines; electromagnetic shielding; integrated circuit interconnections; losses; 0 to 7 GHz; RF integrated circuits; characteristic impedance; dissipative loss; doped layer; on-chip interconnect lines; patterned ground shields; transmission line characteristics; Conductivity; Coupling circuits; Distributed parameter circuits; Impedance; Integrated circuit interconnections; Noise reduction; Pattern analysis; Radio frequency; Silicon; Testing;
Journal_Title :
Microwave and Guided Wave Letters, IEEE
