Impact of test-fixture forward coupling on on-wafer silicon device measurements

Author

Kolding, Troels Emil

Author_Institution

RF Integrated Syst. & Circuits Group, Aalborg, Denmark

Volume

10

Issue

2

fYear

2000

fDate

2/1/2000 12:00:00 AM

Firstpage

73

Lastpage

74

Abstract

Often, the test-fixture forward coupling is ignored during on-wafer device measurements, although existing de-embedding techniques provide means for addressing its effect. In this work it is demonstrated that large errors may occur if forward coupling is not determined and accounted for. An investigation based on basic scaling properties of MOSFETs is proposed as a benchmark test to partially verify de-embedding methods

Keywords

CMOS integrated circuits; MOSFET; UHF integrated circuits; UHF measurement; calibration; elemental semiconductors; error compensation; field effect MMIC; integrated circuit measurement; integrated circuit testing; measurement errors; microwave measurement; silicon; MOSFET; Si; de-embedding techniques; on-wafer silicon device measurements; scaling properties; test-fixture forward coupling; CMOS technology; Circuit testing; Coupling circuits; Displays; Fixtures; Integrated circuit measurements; MOSFETs; Microwave devices; Microwave measurements; Silicon devices;

fLanguage

English

Journal_Title

Microwave and Guided Wave Letters, IEEE

Publisher

ieee

ISSN

1051-8207

Type

jour

DOI

10.1109/75.843105

Filename

843105