Title :
Impact of test-fixture forward coupling on on-wafer silicon device measurements
Author :
Kolding, Troels Emil
Author_Institution :
RF Integrated Syst. & Circuits Group, Aalborg, Denmark
fDate :
2/1/2000 12:00:00 AM
Abstract :
Often, the test-fixture forward coupling is ignored during on-wafer device measurements, although existing de-embedding techniques provide means for addressing its effect. In this work it is demonstrated that large errors may occur if forward coupling is not determined and accounted for. An investigation based on basic scaling properties of MOSFETs is proposed as a benchmark test to partially verify de-embedding methods
Keywords :
CMOS integrated circuits; MOSFET; UHF integrated circuits; UHF measurement; calibration; elemental semiconductors; error compensation; field effect MMIC; integrated circuit measurement; integrated circuit testing; measurement errors; microwave measurement; silicon; MOSFET; Si; de-embedding techniques; on-wafer silicon device measurements; scaling properties; test-fixture forward coupling; CMOS technology; Circuit testing; Coupling circuits; Displays; Fixtures; Integrated circuit measurements; MOSFETs; Microwave devices; Microwave measurements; Silicon devices;
Journal_Title :
Microwave and Guided Wave Letters, IEEE
