DocumentCode
1338493
Title
Programming characteristics of p-channel Si nano-crystal memory
Author
Han, Kwangseok ; Kim, Ilgweon ; Shin, Hyungcheol
Author_Institution
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
Volume
21
Issue
6
fYear
2000
fDate
6/1/2000 12:00:00 AM
Firstpage
313
Lastpage
315
Abstract
In this work, the programming characteristics of a p-channel nano-crystal memory is studied. The hole tunneling component from the inversion layer and the electron tunneling component from the valence band in the nano-crystal were separated successfully by independent measurement of the current at the body terminal and at the source/drain terminal of the memory. For small gate voltage, the hole tunneling current is dominant during programming. However, for large programming voltage, the valence band electron tunneling from the dot into the substrate becomes dominant. Finally, the comparison of retention characteristics between programmed holes and electrons shows that holes have longer retention time.
Keywords
MOS capacitors; PLD programming; inversion layers; nanostructured materials; semiconductor device measurement; semiconductor storage; silicon; tunnelling; valence bands; MOS capacitor; Si-SiO/sub 2/; body terminal; current measurement; dot formation; electron tunneling component; hole tunneling component; inversion layer; large programming voltage; nonvolatile memory; p-channel Si nano-crystal memory; programming characteristics; retention characteristics; retention time; source/drain terminal; valence band; Charge carrier processes; Current measurement; Dielectrics; Electrons; Flash memory; Low voltage; Nanocrystals; Nonvolatile memory; Scalability; Tunneling;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.843161
Filename
843161
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