Title :
Process Variability Effect on Soft Error Rate by Characterization of Large Number of Samples
Author :
Gasiot, Gilles ; Castelnovo, Alexandro ; Glorieux, Maximilien ; Abouzeid, Fady ; Clerc, Sylvain ; Roche, Philippe
Author_Institution :
STMicroelectron., Crolles, France
Abstract :
For the first time die-to-die soft error rate (SER) variability from process manufacturing is experimentally characterized by irradiating a very large number of samples from a single wafer. Alpha and neutron SER is measured and reported as a function of original location on wafer, test dates and samples capacity. CAD tools are then used to evaluate their capacity to assess die-to-die alpha and neutron SER variability.
Keywords :
alpha-particle effects; neutron effects; radiation hardening (electronics); CAD tools; die-to-die alpha soft error rate variability; die-to-die neutron soft error rate variability; process manufacturing; process variability effect; sample capacity; single wafer; test dates; Error analysis; Neutrons; Random access memory; Sampling methods; Semiconductor device measurement; Semiconductor device reliability; System-on-a-chip; Alpha and neutron; die-to-die variability; hardness assurance; large sampling; process variability; soft error rate (SER) experimental characterization;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2012.2225447
