DocumentCode :
1341679
Title :
Bias Influence on Corrosion of Plastic Encapsulated Device Metal Systems
Author :
Reich, Bemard
Author_Institution :
US Army Electronics Technology & Devices Lab.//ATTN: DRSEL-TL-DS//Fort Monmouth, NJ 07703 USA.
Issue :
5
fYear :
1976
Firstpage :
296
Lastpage :
298
Abstract :
Because of apparent anomalies noted on data recorded in tests conducted on PEDs (plastic encapsulated device) a re-examination of the influence of voltage biasing in temperature-humidity-bias testing has been conducted. Applied bias can have an important influence on the reliability of plastic encapsulated transistors, depending on how it is applied. The analysis presented in this paper on the role of bias influence on PED failure rate explains some of the discrepancies that have been noted in the past by the author and other investigators.
Keywords :
Aluminum; Circuit testing; Corrosion; Gold; Metallization; Plastics; Stress; System testing; Voltage; Wire; Failure rate data; Operating tests; Plastic encapsulation; Temperature-humidity-bias test; Test data; Transistors;
fLanguage :
English
Journal_Title :
Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9529
Type :
jour
DOI :
10.1109/TR.1976.5220014
Filename :
5220014
Link To Document :
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