• DocumentCode
    1342465
  • Title

    A Novel Device Architecture for SEU Mitigation: The Inverse-Mode Cascode SiGe HBT

  • Author

    Phillips, Stanley D. ; Thrivikraman, Tushar ; Appaswamy, Aravind ; Sutton, Akil K. ; Cressler, John D. ; Vizkelethy, Gyorgy ; Dodd, Paul ; Reed, Robert A.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    56
  • Issue
    6
  • fYear
    2009
  • Firstpage
    3393
  • Lastpage
    3401
  • Abstract
    We investigate, for the first time, the potential for SEE mitigation of a newly-developed device architecture in a 3rd generation high-speed SiGe platform. This new device architecture is termed the ¿inverse-mode cascode SiGe HBT¿ and is comprised of two standard devices sharing a buried subcollector and operated in a cascode configuration. Verification of the TID immunity is demonstrated using 10 keV X-rays, while an investigation of the SEE susceptibility is performed using a 36 MeV 16O ion. IBICC results show strong sensitivities to device bias with only marginal improvement when compared to a standard device; however, by providing a conductive path from the buried subcollector (C-Tap) to a voltage potential, almost all collected charge is induced on the C-Tap terminal instead of the collector terminal. These results are confirmed using full 3-D TCAD simulations which also provides insight into the physics of this new RHBD device architecture. The implications of biasing the C-Tap terminal in a circuit context are also addressed.
  • Keywords
    Ge-Si alloys; heterojunction bipolar transistors; ion beam effects; radiation hardening; semiconductor device models; semiconductor materials; 3-D TCAD simulations; 16O ion; C-tap terminal; HBT; IBICC; RHBD device architecture; RHBD-RHBP; SEE susceptibility; SEU mitigation; SiGe; TID immunity; device modeling; electron volt energy 10 keV; electron volt energy 36 MeV; inverse-mode cascode HBT; ion beam induced charge; radiation hardening by design; radiation hardening by process; voltage potential; Germanium silicon alloys; Heterojunction bipolar transistors; NASA; Radiation hardening; Silicon germanium; Single event upset; Space technology; Temperature; Topology; X-rays; HBT; SEE; SEU; inverse-mode operation; silicon-germanium (SiGe) technology; total ionizing dose;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2009.2033185
  • Filename
    5341371