DocumentCode
1342756
Title
A Wideband Common-Mode Suppression Filter for Bend Discontinuities in Differential Signaling Using Tightly Coupled Microstrips
Author
Gazda, Celina ; Vande Ginste, Dries ; Rogier, Hendrik ; Wu, Ruey-Beei ; De Zutter, Daniël
Author_Institution
Dept. of Inf. Technol., Ghent Univ., Ghent, Belgium
Volume
33
Issue
4
fYear
2010
Firstpage
969
Lastpage
978
Abstract
A new type of bend is proposed that reduces differential-to-common mode conversion occuring at the bend discontinuity in coupled microstrip lines for high-speed digital circuits. Simultaneously, great care has been taken to minimize the differential reflection coefficient and insertion loss, leading to an overall improved signal integrity. This is achieved by tapering the microstrip lines to tightly or very tightly coupled ones in the area of the bend. Full-wave simulations in the DC to 6 GHz frequency range show that over 9 dB and 14 dB suppression of conversion noise is achieved for tightly coupled and very tightly coupled bends, respectively. Also for these new structures, with a total length of 100 mm, the insertion loss remains below 0.6 dB. Measurements on prototype bends show very good agreement with full-wave simulations. Also time domain measurements demonstrate the significant reduction in conversion noise while keeping return loss low. Moreover, for design purposes, a dedicated circuit model which closely matches the full-wave characteristics of the proposed bends is presented.
Keywords
circuit simulation; coupled circuits; filters; high-speed integrated circuits; integrated circuit modelling; integrated circuit noise; microstrip lines; bend discontinuity; circuit model; conversion noise suppression; coupled microstrip lines; differential reflection coefficient; differential signaling; differential-to-common mode conversion; full-wave simulation; high-speed digital circuit; insertion loss; signal integrity; time domain measurement; wideband common-mode suppression filter; Couplings; Equivalent circuits; Impedance; Integrated circuit modeling; Microstrip; Noise; Solid modeling; Asymmetric discontinuity; coupled bends; differential signaling; differential-to-common mode conversion; modal S-parameters;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2010.2077287
Filename
5594653
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