• DocumentCode
    1343022
  • Title

    Transient analysis of mixed carbon nanotube bundle interconnects

  • Author

    Sathyakam, P. Uma ; Mallick, P.S.

  • Author_Institution
    Sch. of Electr. Eng., VIT Univ., Vellore, India
  • Volume
    47
  • Issue
    20
  • fYear
    2011
  • Firstpage
    1134
  • Lastpage
    1136
  • Abstract
    Presented for the first time is an accurate modelling hierarchy for mixed CNT bundle interconnects. Single-walled CNTs and multi-walled CNTs have been modelled as equivalent single conductor transmission lines and then combined to form a mixed CNT bundle interconnect, which is basically a multiple equivalent single conductor model. Two multiple equivalent single conductor interconnects have been taken to form the multiconductor transmission line model. The delays from transient analysis for both models for a unit bundle have been compared with the corresponding ones for SWCNT bundles and MWCNTs that exist in the literature. It is found that mixed CNT bundle interconnects are superior to both SWCNT bundle and MWCNT interconnects in terms of delay.
  • Keywords
    carbon nanotubes; integrated circuit interconnections; transient analysis; C; MWCNT interconnects; SWCNT bundles; conductor model; delay; mixed CNT bundle interconnects; mixed carbon nanotube bundle interconnects; multiconductor transmission line model; multiwalled CNT; single-walled CNT; transient analysis;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2011.1705
  • Filename
    6036062