Title :
Multiple-chip package embedded on compound board for light emitting diode
Author :
Long, Xi ; Liao, Ruijin ; Zhou, J. ; Zeng, Zhimin
Author_Institution :
Dept. of Phys., Chongqing Normal Univ., Chongqing, China
Abstract :
A simple and efficient packaging technique with aluminium-core printed circuit board component embedded copper reflectors is presented for fabricating high-power white light emitting diode (LED) arrays. Three-dimensional finite element simulation and dynamic infrared imaging for analysis of the packaged nine-chips LED array are carried out to investigate the thermal and optical properties. The results show the method, which obtained a luminous efficiency of 126 lm/W and thermal resistance of 3.4 K/W, is suitable for high efficiency and low-cost LED based solid-state lighting.
Keywords :
electronics packaging; finite element analysis; light emitting diodes; printed circuits; aluminium-core printed circuit board component; compound board; dynamic infrared imaging; embedded copper reflector; high-power white light emitting diode; multiple-chip package; optical properties; packaged nine-chips LED array; packaging technique; solid-state lighting; thermal properties; three-dimensional finite element simulation;
Journal_Title :
Electronics Letters
DOI :
10.1049/el.2011.1783
