DocumentCode :
1343387
Title :
A Study of Accelerated Storage Test Conditions Applicable to Semiconductor Devices and Microcircuits
Author :
Reich, Bernard
Author_Institution :
DRSEL-TL-DS; US Army Electronics Command; Fort Monmouth, NJ 07703 USA.
Issue :
3
fYear :
1978
Firstpage :
178
Lastpage :
180
Abstract :
This preliminary theoretical study on the application of accelerated stress testing for determining storage life of semiconductor devices and microcircuits has resulted in the following conclusions: There are more environmental stresses that can be applied to the accelerated testing of plastic encapsulated microcircuits, than hermetic devices. For hermetic devices, the assurance of initial hermeticity and wire bond integrity should insure long storage-dormancy life. Since only limited storage-dormancy data are available, accelerated testing and verification with use conditions data are necessary to support the conclusion of this study.
Keywords :
Electronic equipment testing; Life estimation; Life testing; Plastics; Reliability theory; Semiconductor device reliability; Semiconductor device testing; Semiconductor devices; Stress; Temperature; Accelerated tests; Microcircuits; Storage environment; Storage reliability;
fLanguage :
English
Journal_Title :
Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9529
Type :
jour
DOI :
10.1109/TR.1978.5220315
Filename :
5220315
Link To Document :
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