Title :
Advanced thermal analysis of packaged electronic systems using computational fluid dynamics techniques
Author :
Reynell, Michael
Author_Institution :
Flomerics, Kingston-upon-Thames, UK
fDate :
8/1/1990 12:00:00 AM
Abstract :
Most electronic system failures are due to thermal overstressing, and the major current trends in electronics design are adding to the thermal problem. This article introduces a new class of electronics thermal analysis tool, which uses computational fluid dynamics (CFD) techniques to predict the three-dimensional air movement and associated heat-transfer processes in electronics enclosures
Keywords :
fluid dynamics; heat transfer; packaging; thermal analysis; computational fluid dynamics; electronic system failures; electronics design; electronics enclosures; heat-transfer processes; packaged electronic systems; thermal analysis; three-dimensional air movement;
Journal_Title :
Computer-Aided Engineering Journal
