• DocumentCode
    1346031
  • Title

    A Novel Method for In Situ Uniaxial Tests at the Micro/Nano Scale—Part I: Theory

  • Author

    Kang, Wonmo ; Saif, M. Taher A

  • Author_Institution
    Dept. of Mech. Sci. & Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • Volume
    19
  • Issue
    6
  • fYear
    2010
  • Firstpage
    1309
  • Lastpage
    1321
  • Abstract
    A novel MEMS-based uniaxial testing apparatus and a specimen design are presented for measuring the mechanical response of material samples in situ in scanning electron microscope (SEM). The stage adopts an assembly approach, where specimens are fabricated independently, allowing testing of a variety of materials. The assembly approach, however, involves intrinsic challenges in achieving pure uniaxial loading at the micro/nanoscale due to off-axis loading (misalignment) errors. The effect of misalignment in stress evaluation increases with decreasing size scale of the sample-an issue that has received limited attention in the literature. Here, the source of intrinsic misalignment and its influence on the stress nonuniformity are explored analytically and numerically. This paper reveals substantial bending of the microspecimen due to small and often unavoidable off-axis loading. The proposed stage and the specimen ensure uniaxial loading by introducing hingelike self-aligning mechanisms both in the stage as well as in the specimen. The analysis offers the parameter space to design and optimize uniaxial tests at the micro/nanoscale.
  • Keywords
    bending; materials testing; mechanical testing; microfabrication; micromechanical devices; strain measurement; stress measurement; MEMS-based uniaxial testing apparatus; SEM; bending; hingelike self-aligning mechanism; material samples; mechanical response measurement; microelectromechanical device; microscale uniaxial loading; misalignment error; nanoscale uniaxial loading; off-axis loading error; scanning electron microscope; strain measurement; stress measurement; Materials testing; Microassembly; Nanoscale devices; Strain measurement; Stress measurement; Electron microscopy; materials testing; microassembly; microelectromechanical devices; strain measurement; stress measurement;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2010.2076779
  • Filename
    5597908