• DocumentCode
    1346037
  • Title

    A Novel Method for In Situ Uniaxial Tests at the Micro/Nanoscale—Part II: Experiment

  • Author

    Kang, Wonmo ; Han, Jong H. ; Saif, M. Taher A

  • Author_Institution
    Dept. of Mech. Sci. & Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • Volume
    19
  • Issue
    6
  • fYear
    2010
  • Firstpage
    1322
  • Lastpage
    1330
  • Abstract
    Here, we experimentally investigate the sources of misalignment during uniaxial test and their substantial influence on mechanical measurement of microspecimens. To avoid possible misalignment errors, we propose a novel MEMS-based uniaxial testing stage and a specimen design for measuring the mechanical response of material samples in situ in scanning electron microscope (SEM). The proposed stage and the specimen ensure uniaxiality of loading due to the introduction of hingelike self-aligning mechanisms both in the stage and in the specimen. Using the stage and the sample, we measure the elastic modulus of single-crystal silicon (SCS) within 99.5% of the known value. We also experimentally demonstrate that the bending strain due to any misalignment can be limited to within 1% of the average strain by using the proposed stage and specimen.
  • Keywords
    compressive testing; elastic moduli measurement; mechanical variables measurement; micromechanical devices; silicon; specimen preparation; tensile testing; MEMS based uniaxial testing; Si; elastic modulus measurement; in situ in scanning electron microscope; in situ uniaxial tests; mechanical measurement; microspecimens; misalignment errors; single crystal silicon; Electron microscopy; Materials testing; Microassembly; Nanoscale devices; Strain measurement; Stress measurement; Electron microscopy; materials testing; microassembly; microelectromechanical devices; strain measurement; stress measurement;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2010.2076782
  • Filename
    5597909