DocumentCode
1346037
Title
A Novel Method for In Situ Uniaxial Tests at the Micro/Nanoscale—Part II: Experiment
Author
Kang, Wonmo ; Han, Jong H. ; Saif, M. Taher A
Author_Institution
Dept. of Mech. Sci. & Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Volume
19
Issue
6
fYear
2010
Firstpage
1322
Lastpage
1330
Abstract
Here, we experimentally investigate the sources of misalignment during uniaxial test and their substantial influence on mechanical measurement of microspecimens. To avoid possible misalignment errors, we propose a novel MEMS-based uniaxial testing stage and a specimen design for measuring the mechanical response of material samples in situ in scanning electron microscope (SEM). The proposed stage and the specimen ensure uniaxiality of loading due to the introduction of hingelike self-aligning mechanisms both in the stage and in the specimen. Using the stage and the sample, we measure the elastic modulus of single-crystal silicon (SCS) within 99.5% of the known value. We also experimentally demonstrate that the bending strain due to any misalignment can be limited to within 1% of the average strain by using the proposed stage and specimen.
Keywords
compressive testing; elastic moduli measurement; mechanical variables measurement; micromechanical devices; silicon; specimen preparation; tensile testing; MEMS based uniaxial testing; Si; elastic modulus measurement; in situ in scanning electron microscope; in situ uniaxial tests; mechanical measurement; microspecimens; misalignment errors; single crystal silicon; Electron microscopy; Materials testing; Microassembly; Nanoscale devices; Strain measurement; Stress measurement; Electron microscopy; materials testing; microassembly; microelectromechanical devices; strain measurement; stress measurement;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2010.2076782
Filename
5597909
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