DocumentCode :
1346525
Title :
Micromachining process simulation using a continuous cellular automata method
Author :
Zhu, Zhenjun ; Liu, Chang
Author_Institution :
Micro Actuators, Sensor & Syst. Group, Illinois Univ., Urbana, IL, USA
Volume :
9
Issue :
2
fYear :
2000
fDate :
6/1/2000 12:00:00 AM
Firstpage :
252
Lastpage :
261
Abstract :
In this paper, we present results on the development of an anisotropic crystalline etching simulation (AGES) program based on a continuous cellular automata (CA) model. The program provides improved spatial resolution and accuracy compared with the conventional and stochastic CA methods. Implementation of a three-dimensional (3-D) dynamic CA technique provides increased simulation speed and reduced memory requirement. The first AGES software based on common personal computer platforms has been realized for simulation of micromachining processes and visualizing results in 3-D space. The software is uniquely capable of simulating the resultant profile following a series of micromachining steps, including surface passivation, reactive ion etching, as well as wet chemical bulk etching. A novel method for accurately obtaining the etch-rate diagram of anisotropic etching using both experimental and numerical techniques has been developed.
Keywords :
cellular automata; digital simulation; electronic engineering computing; engineering graphics; etching; micromachining; micromechanical devices; passivation; semiconductor process modelling; silicon; sputter etching; 3D MEMS structures; MEMS fabrication; RIE; Si; anisotropic crystalline etching simulation program; continuous cellular automata method; etch-rate diagram; memory requirement reduction; micromachining process simulation; numerical techniques; personal computer platforms; profile simulation; reactive ion etching; simulation speed improvement; surface passivation; wet chemical bulk etching; Anisotropic magnetoresistance; Computational modeling; Computer simulation; Crystallization; Microcomputers; Micromachining; Spatial resolution; Stochastic processes; Visualization; Wet etching;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.846706
Filename :
846706
Link To Document :
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