Title :
High-Performance Gate-First Epitaxial Ge n-MOSFETs on Si With
Gate Dielectrics
Author :
Chen, W.B. ; Cheng, C.H. ; Chin, Albert
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
This brief presents high-performance Ge n-MOSFETs with good high-field mobility of 218 cm2/V · s at 0.5 MV/cm, low subthreshold swing (SS) of 108 mV/dec, small equivalent oxide thickness (EOT) of 1.6 nm, low 7 × 10-10 A/μm OFF-state leakage, small bias temperature instability of 31 mV at 1.2 V overdrive and 85°C, and full process compatibility with current very large-scale integration fabrication. These are one of the best SS and high-field mobility data among gate-first Ge n-MOSFETs using epitaxial Ge on 6-in Si wafer and proper high-κ LaAlO3 dielectric without using an interfacial layer. Using a different high-κ HfAlO gate dielectric, the Ge n-MOSFETs showed poor leakage, large flatband voltage shift, and degraded EOT.
Keywords :
MOSFET; germanium; lanthanum compounds; large scale integration; silicon; Ge; LaAlO3; LaAlO3 gate dielectrics; OFF-state leakage; Si; current very large-scale integration fabrication; equivalent oxide thickness; high-performance gate-first epitaxial Ge n-MOSFET; size 1.6 nm; small bias temperature instability; subthreshold swing; temperature 85 C; voltage 1.2 V; voltage 31 mV; Capacitors; Germanium; High K dielectric materials; MOSFETs; Silicon; $ hbox{LaAlO}_{3}$; Equivalent oxide thickness (EOT); Ge; TaN; high- $kappa$; n-MOSFETs;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2010.2079270