DocumentCode :
1347192
Title :
Micropositioning of a weakly calibrated microassembly system using coarse-to-fine visual servoing strategies
Author :
Ralis, Stephen J. ; Vikramaditya, Barmeshwar ; Nelson, Bradley J.
Author_Institution :
Electroglas Inc., Corvallis, OR, USA
Volume :
23
Issue :
2
fYear :
2000
fDate :
4/1/2000 12:00:00 AM
Firstpage :
123
Lastpage :
131
Abstract :
This paper presents a novel visual servoing framework for micropositioning in three dimensions for assembly and packaging of hybrid microelectromechanical systems (MEMS). The framework incorporates a supervisory logic-based controller that selects feedback from multiple visual sensors in order to execute a microassembly task. The introduction of a visual sensor array allows the motion of microassembly tasks to be controlled globally with a wide angle view at the beginning of the task. Then a high precision view is used for fine motion control at the end of the task. In addition, a depth-from-focus technique is used to visually servo along the optical axis, providing the ability to perform full three-dimensional (3-D) micropositioning under visual control. The supervisory logic-based controller selects the relevant sensor and tracking strategy to be used at a particular stage in the assembly process, allowing the system to take full advantage of the individual sensor´s attributes such as field-of-view, resolution, and depth-of-field. The combination of robust visual tracking and depth estimation within a supervisory control architecture is used to perform high-speed, automatic microinsertions in three dimensions. Experimental results are presented for a micro insertion task performed under this framework in order to demonstrate the feasibility of the approach in high precision assembly of MEMS. Results demonstrate that a relative parts placement repeatable to 2 μm in XY and 10 μm in Z is possible without the use of costly vibration isolation equipment and thermal management systems
Keywords :
feedback; image processing; microassembling; micromechanical devices; micropositioning; motion control; optimal control; packaging; servomechanisms; tracking; 3D micropositioning; coarse-to-fine visual servoing strategies; depth estimation; depth-from-focus technique; depth-of-field; feedback selection; fine motion control; high precision view; high-speed automatic microinsertions; hybrid MEMS; hybrid microelectromechanical systems; packaging; supervisory logic-based controller; tracking strategy; visual sensor array; weakly calibrated microassembly system; wide angle view; Assembly systems; Feedback; Microassembly; Microelectromechanical systems; Micromechanical devices; Motion control; Packaging; Sensor arrays; Thermal management; Visual servoing;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/6104.846935
Filename :
846935
Link To Document :
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