مرکز منطقه ای اطلاع رساني علوم و فناوري - Correction to "High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles"

DocumentCode :

1347217

Title :

Correction to "High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles"

Author :

Varyiyam, M. ; Sundararaman, Vijayaraghavan ; Sitaraman, Suresh K. ; Wu, Junyong ; Wong, C.P.

Volume :

Issue :

fYear :

2000

fDate :

4/1/2000 12:00:00 AM

Firstpage :

148

Lastpage :

148

Keywords :

Biographies; Error correction; Semiconductor thin films; Silicon; Transistors;

fLanguage :

English

Journal_Title :

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher :

ieee

ISSN :

1521-334X

Type :

jour

DOI :

10.1109/TEPM.2000.846938

Filename :

846938

Link To Document :