Title :
A multilevel parasitic interconnect capacitance modeling and extraction for reliable VLSI on-chip clock delay evaluation
Author_Institution :
Digital Compression Products, Texas Instrum. Inc., Dallas, TX, USA
fDate :
4/1/1998 12:00:00 AM
Abstract :
This paper describes fringing and coupling interconnect capacitance models which include the nonlinear second-order effects of field interactions among multilevel parasitic interconnects for accurate circuit simulations. They are fitted well with numerical solutions by using a Poisson equation solver. A reliable parasitic distributed resistance-inductance-capacitance (RLC) extraction method is identified by using the solver with the bounded local three-dimensional (3-D) numerical analysis to reduce excessive central processing unit (CPU) time compared to full 3-D numerical simulation. We investigate the impact of input slew variations on the traversal clock delay within the slow ramp region of the driver gate as well as in the extracted parasitic interconnect networks. Input slew is found to be a dominant factor affecting clock delay sensitivity. In addition, we use indirect on-chip electron beam probing to confirm that the simulated clock delays are in reasonable agreement with the measured delays
Keywords :
VLSI; capacitance; clocks; delays; integrated circuit interconnections; integrated circuit modelling; Poisson equation; VLSI on-chip clock delay; circuit simulation; coupling capacitance; electron beam probing; fringing capacitance; input slew; multilevel parasitic interconnect capacitance model; nonlinear second-order effects; parasitic distributed RLC extraction; three-dimensional numerical analysis; Central Processing Unit; Circuit simulation; Clocks; Coupling circuits; Delay; Integrated circuit interconnections; Numerical analysis; Numerical simulation; Parasitic capacitance; Poisson equations;
Journal_Title :
Solid-State Circuits, IEEE Journal of