Title :
Impedance Matching of Traces and Multilayer via Transitions for On-Package Links
Author :
Hernandez-Sosa, Gaudencio ; Torres-Torres, Reydezel ; Sanchez, Adán
Author_Institution :
Dept. of Elec tronics, Inst. Nac. de Astrofis., Opt. y Electron. (INAOE), Tonanzintla, Mexico
Abstract :
A method for achieving impedance matching between traces and multilayer via transitions in on-package chip-to-chip links is presented. The method allows determining of the geometry for minimizing the return loss when a signal propagates through the link. For this purpose, analytical equations are derived using a physically-based equivalent circuit to represent the input impedance of multilayer via transitions. S -parameter measurements performed to optimized links using the method demonstrate the usefulness of the proposal.
Keywords :
S-parameters; electronics packaging; equivalent circuits; impedance matching; multilayers; S-parameter measurements; analytical equations; impedance matching; multilayer via transitions; on-package chip-to-chip links; physically-based equivalent circuit; return loss; trace via transitions; Capacitance; Impedance; Impedance matching; Integrated circuit modeling; Mathematical model; Nonhomogeneous media; Surface impedance; Impedance matching; return loss; vias;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2011.2167136
