An experimental thermal siphon bushing

Author

Zeng, Daxiong

Author_Institution

Lapp Insulator Co., LeRoy, NY, USA

Volume

15

Issue

1

fYear

2000

fDate

1/1/2000 12:00:00 AM

Firstpage

175

Lastpage

177

Abstract

An experimental thermal siphon bushing was constructed and tested. The thermal siphon was made from the hollow conductor of a paper-resin bushing with water as heat transport fluid. The test shows that this bushing has almost uniform temperature distribution under its critical current and the temperature of its hottest spot is close to the boiling temperature of water. The current carrying capacity of this thermal siphon bushing is 50% more than that of the same bushing without thermal siphon. Simple formulas are proposed to determine the critical current of a thermal siphon bushing and estimate the temperature of the hottest spot if the bushing with thermal siphon is operated above the nameplate rating

Keywords

bushings; condensation; conductors (electric); cooling; evaporation; paper; polymers; temperature distribution; 1200 A; 350 kV; condensation; critical current; current carrying capacity; evaporation; heat transport fluid; hollow conductor; hottest spot temperature; paper-resin bushing; thermal siphon bushing; uniform temperature distribution; water; Conductors; Cooling; Copper; Critical current; Insulators; Petroleum; Temperature distribution; Testing; Thermal conductivity; Water heating;

fLanguage

English

Journal_Title

Power Delivery, IEEE Transactions on

Publisher

ieee

ISSN

0885-8977

Type

jour

DOI

10.1109/61.847247

Filename

847247