• DocumentCode
    1348405
  • Title

    Thermal Design of Electronic-Circuit Layout For Reliability

  • Author

    Gupta, Hariom ; Sharma, Jaydev

  • Author_Institution
    Department of Electrical Engineering; University of Roorkee; Roorkee, 247672 INDIA.
  • Issue
    1
  • fYear
    1982
  • fDate
    4/1/1982 12:00:00 AM
  • Firstpage
    19
  • Lastpage
    22
  • Abstract
    A method for laying out electronic components on back board, which minimizes the maximum temperature rise of components is presented. This avoids hot spots on the board. Sensitivity analysis is adopted for optimal placement of components on the circuit board and certain relations are derived with a view to reduce the computational effort of sensitivity analysis.
  • Keywords
    Electronic components; Electronic packaging thermal management; Heat sinks; Power dissipation; Printed circuits; Sensitivity analysis; Temperature distribution; Temperature sensors; Thermal engineering; Thermal resistance; Layout; Thermal coupling; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/TR.1982.5221214
  • Filename
    5221214
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1348405