Title :
Nanomaterials for Electronic Packaging: Toward Extreme Miniaturization [Nanopackaging]
Author :
Das, Rabindra N. ; Markovich, Voya R.
Abstract :
This article examines the use of nanomaterials in the area of electronic packaging. This includes capacitors and resistors as embedded passives, low-k materials, electrically conducting adhesives (ECAs) as interconnects, thermal interface materials (TIMs), etc.
Keywords :
capacitors; electronics packaging; nanostructured materials; resistors; ECA; TIM; capacitors; electrically conducting adhesives; electronic packaging; embedded passives; interconnects; low-k materials; nanomaterials; resistors; thermal interface materials; Electronics packaging; Industrial electronics; Nanomaterials;
Journal_Title :
Nanotechnology Magazine, IEEE
DOI :
10.1109/MNANO.2010.938653
