• DocumentCode
    1348936
  • Title

    Nanomaterials for Electronic Packaging: Toward Extreme Miniaturization [Nanopackaging]

  • Author

    Das, Rabindra N. ; Markovich, Voya R.

  • Volume
    4
  • Issue
    4
  • fYear
    2010
  • Firstpage
    18
  • Lastpage
    26
  • Abstract
    This article examines the use of nanomaterials in the area of electronic packaging. This includes capacitors and resistors as embedded passives, low-k materials, electrically conducting adhesives (ECAs) as interconnects, thermal interface materials (TIMs), etc.
  • Keywords
    capacitors; electronics packaging; nanostructured materials; resistors; ECA; TIM; capacitors; electrically conducting adhesives; electronic packaging; embedded passives; interconnects; low-k materials; nanomaterials; resistors; thermal interface materials; Electronics packaging; Industrial electronics; Nanomaterials;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    1932-4510
  • Type

    jour

  • DOI
    10.1109/MNANO.2010.938653
  • Filename
    5599963
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1348936