Title :
A Si/Glass Bulk-Micromachined Cryogenic Heat Exchanger for High Heat Loads: Fabrication, Test, and Application Results
Author :
Zhu, Weibin ; White, Michael J. ; Nellis, Gregory F. ; Klein, Sanford A. ; Gianchandani, Yogesh B.
Author_Institution :
Dept. of Mech. Eng., Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
This paper reports on a micromachined Si/glass stack recuperative heat exchanger with in situ temperature sensors. Numerous high-conductivity silicon plates with integrated platinum resistance temperature detectors (Pt RTDs) are stacked, alternating with low-conductivity Pyrex spacers. The device has a 1 ?? 1-cm2 footprint and a length of up to 3.5 cm. It is intended for use in Joule-Thomson (J-T) coolers and can sustain pressure exceeding 1 MPa. Tests at cold-end inlet temperatures of 237 K-252 K show that the heat exchanger effectiveness is 0.9 with 0.039-g/s helium mass flow rate. The integrated Pt RTDs present a linear response of 0.26%-0.30%/K over an operational range of 205 K-296 K but remain usable at lower temperatures. In self-cooling tests with ethane as the working fluid, a J-T system with the heat exchanger drops 76.1 K below the inlet temperature, achieving 218.7 K for a pressure of 835.8 kPa. The system reaches 200 K in transient state; further cooling is limited by impurities that freeze within the flow stream. In J-T self-cooling tests with an external heat load, the system reaches 239 K while providing 1 W of cooling. In all cases, there is an additional parasitic heat load estimated at 300-500 mW.
Keywords :
Joule-Thomson effect; cooling; cryogenic electronics; glass; heat exchangers; micromachining; temperature sensors; Joule-Thomson coolers; RTD; bulk-micromachined Si-glass cryogenic heat exchanger; helium mass flow rate; high heat loads; high-conductivity silicon plates; low-conductivity Pyrex spacers; parasitic heat load; platinum resistance temperature detectors; power 300 mW to 500 mW; pressure 835.8 kPa; recuperative heat exchanger; self-cooling tests; size 1 cm; temperature 200 K; temperature 237 K to 257 K; temperature sensors; in situ temperature sensing; Cryosurgery; Joule–Thomson (J–T) cooler; micromachined heat exchanger;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2009.2034322