DocumentCode
1350621
Title
Applications literature: Applying thermal analysis to electronics manufacturing
Volume
15
Issue
8
fYear
1978
Firstpage
78
Lastpage
83
Abstract
This 16-page booklet contains 20 application studies that demonstrate the usefulness of the three primary thermal analysis techniques: differential scanning calorimetry, thermogravimetric analysis, and thermomechanical analysis. A spectrum of parameters related to electronics manufacturing are characterized, including PC board composition, component encapsulation, and wire insulation.
Keywords
Contacts; Educational institutions; Electrical engineering; Equal opportunities; Remuneration; Resumes;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/MSPEC.1978.6367852
Filename
6367852
Link To Document