DocumentCode :
1350846
Title :
Chip-to-chip communication using a single flux quantum pulse
Author :
Maezawa, M. ; Yamamori, H. ; Shoji, A.
Author_Institution :
Electrotech. Lab., Ibaraki, Japan
Volume :
10
Issue :
2
fYear :
2000
fDate :
6/1/2000 12:00:00 AM
Firstpage :
1603
Lastpage :
1605
Abstract :
Chip-to-chip propagation of a single flux quantum (SFQ) pulse has been demonstrated using an active multichip module (MCM) technique in which active transmitters and receivers are integrated on an MCM substrate as well as on a chip. A chip-to-chip SFQ transfer circuit has been designed and implemented by a standard Nb-trilayer process and solder-bumped flip-chip technology. The correct operation of the circuit has been confirmed by low-frequency testing. Experimental margins for the global factor for bias currents have been as large as /spl plusmn/33%.
Keywords :
flip-chip devices; multichip modules; superconducting integrated circuits; Josephson junction; Nb; Nb trilayer process; SFQ transfer circuit; active multichip module; chip-to-chip communication; single flux quantum pulse; solder-bumped flip-chip technology; Circuit testing; Connectors; Distributed parameter circuits; Inductance; Josephson junctions; Multichip modules; Power transmission lines; Pulse generation; Superconducting transmission lines; Transmitters;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.848308
Filename :
848308
Link To Document :
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