Title :
A thermal and congestion driven global router for 3D integrated circuits
Author :
Roy, Debashri ; Ghosal, Prasun ; Das, Nabanita
Author_Institution :
Dept. of IT, Bengal Eng. & Sci. Univ., Shibpur, India
fDate :
Feb. 28 2014-March 2 2014
Abstract :
During recent days, the large problem space of very large scale integrated (VLSI) circuits has led global routing problem to a NP Complete one. With the advent of three dimensional integrated circuits (3D IC) the problem has become more complex. In this paper, a multi-objective global routing technique is formulated using fuzzy logic to get rid of the limitations of deterministic approaches. During global routing the decision is taken from a fuzzy logic expert system depending upon some generated pre-routing guiding information. Proposed approach is mainly focused on the modern generation 3D ICs. This primary work is mainly incorporated in the standard cell design for 3D ICs. A two-pin global router tool is designed based on the proposed algorithm resulting 85-97% routability in negligible time for ISPD´98 benchmarks.
Keywords :
VLSI; benchmark testing; fuzzy logic; integrated circuit design; integrated circuit testing; three-dimensional integrated circuits; 3D integrated circuits; ISPD´98 benchmarks; VLSI; congestion driven global router; fuzzy logic; multiobjective global routing; very large scale integrated circuits; Benchmark testing; Expert systems; Fuzzy logic; Integrated circuits; Routing; Sensitivity; Three-dimensional displays; 3D Global Routing; 3D Integrated Circuits; Fuzzified Global Routing; Fuzzy Expert System; VLSI Layout Design;
Conference_Titel :
Students' Technology Symposium (TechSym), 2014 IEEE
Conference_Location :
Kharagpur
Print_ISBN :
978-1-4799-2607-7
DOI :
10.1109/TechSym.2014.6808065
