DocumentCode :
1351545
Title :
Carbon Nanotubes as a Framework for High-Aspect-Ratio MEMS Fabrication
Author :
Hutchison, David N. ; Morrill, Nicholas B. ; Aten, Quentin ; Turner, Brendan W. ; Jensen, Brian D. ; Howell, Larry L. ; Vanfleet, Richard R. ; Davis, Robert C.
Author_Institution :
Dept. of Phys. & Astron., Brigham Young Univ., Provo, UT, USA
Volume :
19
Issue :
1
fYear :
2010
Firstpage :
75
Lastpage :
82
Abstract :
A class of carbon-nanotube (CNT) composite materials was developed to take advantage of the precise high-aspect-ratio shape of patterned vertically grown nanotube forests. These patterned forests were rendered mechanically robust by chemical vapor infiltration and released by etching an underlying sacrificial layer. We fabricated a diverse variety of functional MEMS devices, including cantilevers, bistable mechanisms, and thermomechanical actuators, using this technique. A wide range of chemical-vapor-depositable materials could be used as fillers; here, we specifically explored infiltration by silicon and silicon nitride. The CNT framework technique may enable high-aspect-ratio MEMS fabrication from a variety of materials with desired properties such as high-temperature stability or robustness. The elastic modulus of the silicon-nanotube and silicon nitride-nanotube composites is dominated by the filler material, but they remain electrically conductive, even when the filler (over 99% of the composite´s mass) is insulating.
Keywords :
cantilevers; carbon nanotubes; composite materials; elemental semiconductors; micromechanical devices; silicon; silicon compounds; CNT framework technique; bistable mechanisms; cantilevers; carbon nanotube composite materials; chemical vapor infiltration; chemical-vapor-depositable materials; elastic modulus; filler material; functional MEMS devices; high-aspect-ratio MEMS fabrication; high-temperature stability; nanotube forests; sacrificial layer; silicon nitride-nanotube composites; thermomechanical actuators; Carbon; fabrication; microelectromechanical devices; nanotechnology;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2009.2035639
Filename :
5350708
Link To Document :
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